A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

Blog Article

A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and Poly V Belt reliability management.The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging.Under 1 W/cm2, the areal temperature decreased from 38.5 °C (without Sn-ball) to 32.3 °C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package.

Specifically, the introduction of the metal ball structure engendered a two- Adapters to three-fold increase in lifetime.The study findings could contribute toward integrating quantum dots into photonic devices.